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Finite Element Analysis for VCSEL Packaging

Foster-Miller applied finite element analysis (FEA) to an innovative solution for electronic packaging of a Vertical Cavity Surface Emitting Laser (VCSEL). The package is assembled by thermally welding the components together, heating the bonding surfaces near the melt temperature. The thermally induced stresses and strains must not produce permanent deflections greater than 0.4 microns. Also, the deflections encountered during operation over the temperature range –40o to +85°C must not exceed 0.4 microns. The model includes the VCSEL, the CMOS substrate, LCP circuit board, LCP connector frame and the optical fiber array coupling block. FEA showed how to assemble the components so that deflections stayed within the limit. The VCSELS will be used in highly parallel optical interconnections for communications within and between processing units was conducted using Finite Element methods.

The entire assembly process of the structure was analyzed as follows: The two components (VCSEL and CMOS) of group 1 were heated to 280oC and bonded together. Group 1 was then cooled down to 185oC and bonded to group 2, three components (LCP circuit, molded LCP, and MMC) of which had been bonded at 185oC. The assembled groups 1 and 2 were then cooled down to 154oC and bonded to group 3 which had been heated to 154oC.

The entire simulation was solved for displacements; stresses and strains at the end of each step were obtained.

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