Under contract to the US Army Missile Command, Foster-Miller is developing a low-cost micro-electromechanical system (MEMS) packaging technology based on liquid crystal polymer (LCP) substrates.  This technology is lower in cost than other types of packaging, and will provide sensors and actuators for applications in photonics, biosensing, and inertial and vibration sensing. The need for MEMS-based devices is fueled by smaller sizes of consumer and telecommunications products, calling for low-cost products for these markets.

During the first phase of the project, we demonstrated the ability to form microstructures in LCP using traditional MEMS processes such as lamination and laser welding; and non-traditional microfabrication techniques including embossing, laser ablation, and ultrasonic ablation. We also conceptualized a complete packaging approach based on the fabrication results that offers the potential to dramatically reduce the cost of MEMS-based subsystems.

The ongoing work will develop a panel level packaging process, and design and fabricate a technology demonstration vehicle.

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