In this program, Foster-Miller developed an innovative way to mount arrays of vertical cavity surface emitting lasers (VCSELs) in a dimensionally stable package. Our approach uses liquid crystal polymer (LCP) substrates that have a coefficient of thermal expansion (CTE) matched to the VCSEL doped silicon. As the devices change temperature from -40°C to over 125°C during operation, the LCP substrate provides constant alignment, with sub-micron accuracy. The relatively low-cost assembly competes well against ceramic packages and is targeted for use in highly parallel optical interconnections for communications within and between processor units. Packaging of these devices to date has suffered in several areas, principally cost, simplicity of alignment and immunity to shock and vibration. Foster-Miller’s approach will be combined with advanced heat sinking materials to provide highly reliable packaging for interconnect applications, amenable to expansion to large parallel arrays.
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